PCB technical capabilities
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Process capability and checking parameters |
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ITEM |
Technical capabilities |
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Layers |
2-64layers |
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1200mm*610mm |
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79"*24" |
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0.15mm--10.0mm |
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0.01"--0.4" |
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Finished?Copper?Thickness |
17um-420um |
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0.5OZ--12OZ |
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Min.Trace Width/Space |
0.075mm/0.065mm |
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0.003"/0.0026" |
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Min.Hole Size |
0.1mm |
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0.006" |
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Hole Dim. Tolerance(PTH) |
±0.05mm |
|
±0.002" |
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NPTH |
±0.05mm |
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±0.002" |
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Drill Location Tolerance |
±0.05mm |
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±0.002" |
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V-CUT |
20-90 degree |
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/ |
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V-CUT |
0.25mm |
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0.01" |
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CNC Routing Tolerance |
±0.1mm |
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±0.004" |
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Min.Blind/Buried Via |
0.1mm |
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0.0039" |
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Plug Hole Size |
0.2mm--0.5mm |
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0.008"--0.02" |
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BGAMin.BGA PAD |
0.2mm |
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0.008" |
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Materials |
FR4 (designated brand materials: such as KB, Shengyi, ITEQ, NANYA, EMC,CENS and so on), high frequency board, Teflon board, ceramic board, Rogers board and so on |
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Surface Finish |
immersion gold/OSP/plating Gold (soft/hard) /hot air leveling (HASL)/immersion Silver/immersion Tin/plating Tin/Carbon ink/Gold-finger |
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Warp&Twist |
≤0.75% |
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Electrical Testing |
50--300V |
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Solderability Testing |
245±5℃,3sec Wetting area least95% |
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Thermal Cycling Testing |
288±5℃,10sec,3cycles |
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Ionic Contamination Testing |
Pb,Hg,Cd,Cr(VI),PBB,PBDE<=1000ppm |
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Pb,Hg,Cd,Cr(VI),PBB,PBDE?six items are less than 1000ppm |
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Soldmask Adhesion Testing |
260℃+/-5,10S，3times |
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Special Technology |
Half hole, high Tg board, mixed pressure plate, halogen-free board, ultra-thin and ultra-thick board, bonding, impedance, blue glue, carbon oil, electric thick gold, nickel palladium, gold finger, blind gong, buried blind hole, countersunk hole, resin plug hole, soft hard bonding board, HDI, etc. |
CONTACT US
Overseas Business：
Contact:Hoon Kim
Telephone:+82-10-2745-5228
E-mail:sbeng82@chol.com
Address: Rooms 1318-19,13/F,Hollywood Plaza,610 Nathan Road Mongkok,Kowloon,Hong Kong.
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