Company Profile
Yes international(HongKong)Co.,Limited
Yes international(HongKong)Co.,Limited was established in 2016. We are a high-tech enterprise dedicated to the research and production of high-precision multi-layer circuit boards, fast boards, special PCBs, and semiconductor chip packaging substrates. We provide customers with one-stop services for fast sampling, small and medium batch production, and large-scale production.Yes international(HongKong)Co.,Limited actively participates in the technological progress of its partners, continuously improves complex process processes, and benchmarks its technical capabilities with international advanced levels. It deeply cooperates with customers in multiple fields such as intelligent electronics, communication technology, power supply technology, industrial control, security engineering, automotive industry, medical control, military industry, aerospace, and optoelectronic engineering, providing high-value overall solutions from design to testing delivery. The core technical personnel of the company team have over 20 years of experience in packaging technology and packaging substrate research and mass production management. With professional production technology, advanced production equipment and management mode, we have been highly praised by customers in the fierce market competition.
Yes international(HongKong)Co.,Limited adheres to the quality policy of "comprehensive quality control, zero defects in quality, and complete customer satisfaction", effectively ensuring the intrinsic quality and reliability of its products.
Experience
Factory area
Number of employees
Partners
Production Line
We are a high-tech enterprise dedicated to the research and production of high-precision multi-layer circuit boards, fast boards, special PCBs, and semiconductor chip packaging substrates
Inspection and Test Equipment
We are a high-tech enterprise dedicated to the research and production of high-precision multi-layer circuit boards, fast boards, special PCBs, and semiconductor chip packaging substrates
AOI+VRS
3D Graphic Test
3D Thickness Test
E-Test
Metallurgical Microscope
Wire Bonding Test Peel Strength
AOI+VRS
3D Graphic Test
3D Thickness Test
E-Test
Metallurgical Microscope
Wire Bonding Test Peel Strength
CONTACT US
Overseas Business：
Contact:Hoon Kim
Telephone:+82-10-2745-5228
E-mail:sbeng82@chol.com
Address: Rooms 1318-19,13/F,Hollywood Plaza,610 Nathan Road Mongkok,Kowloon,Hong Kong.
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