WB-CSP substrate technology capability

Date:

Jun 06,2024

Substrate features ·2-6 layer board ·Packaging method: WB ·Size: 3x3mm -23x23mm ·Plate thickness: 0.11mm~0.56mm ·Line width/line spacing: 25/25 μ m~40 μ m/40 μ m Application area Application processors for mobile phones, tablets, set-top boxes, etc

WB-CSP substrate technology capability
·Layers/layer amount: 2,4,6
·Line width/line spacing: 30/30 μ m, dense lines
·Finger width/finger spacing finger space: 90/40 μ m
·Ink type/older resistor type: liquid and dry film type/liquid and dry film type
·Strict ink flatness requirement/Strict SM flatness control ≤ 5 μ m
·Ink alignment SM Registration: ± 20 μ m
·Support Inner Layer Cu Thickness 1OZ
·Support impedance design/Support Impedance
·Support for lead-free nickel gold electroplating design/Support Bussless
Application area
Application processors for mobile phones, tablets, set-top boxes, etc