Yanshen Technology
Key words:
·Line width/line spacing: 12/12 μ m, dense lines ·Center to center distance of ball welding pad/Lump pitch: 180 μ ·Ink type/older resistor type: dry film type/liquid and dry film type ·Typical Surface Finish: OSP ·Ink alignment SM Registration: ± 20 μ m ·Support impedance design/Support Impedance Substrate features
Key words:
·Line width/line spacing: 12/12 μ m, dense lines ·Center to center distance of ball welding pad/Lump pitch: 180 μ ·Ink type/older resistor type: dry film type/liquid and dry film type ·Typical Surface Finish: OSP ·Ink alignment SM Registration: ± 20 μ m ·Support impedance design/Support Impedance Substrate features
Key words:
·Line width/line spacing: 12/12 μ m, dense lines ·Center to center distance of ball welding pad/Lump pitch: 180 μ ·Ink type/older resistor type: dry film type/liquid and dry film type ·Typical Surface Finish: OSP ·Ink alignment SM Registration: ± 20 μ m ·Support impedance design/Support Impedance Substrate features
Key words:
High and multi-layer circuit boards
·Line width/line spacing: 12/12 μ m, dense lines ·Center to center distance of ball welding pad/Lump pitch: 180 μ ·Ink type/older resistor type: dry film type/liquid and dry film type ·Typical Surface Finish: OSP ·Ink alignment SM Registration: ± 20 μ m ·Support impedance design/Support Impedance Substrate features
Key words:
FC-CSP substrate technology capability
Substrate features ·2-6 layer board ·Packaging method: FC ·Line width/line spacing: 12/12 μ m~25 μ m/25 μ m Application area FCCSP substrates are used for packaging high-end processor chips in fields such as smartphones, tablets, and multimedia devices.
Key words:
WB-CSP substrate technology capability
Substrate features ·2-6 layer board ·Packaging method: WB ·Size: 3x3mm -23x23mm ·Plate thickness: 0.11mm~0.56mm ·Line width/line spacing: 25/25 μ m~40 μ m/40 μ m Application area Application processors for mobile phones, tablets, set-top boxes, etc
Key words:
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Overseas Business：
Contact:Hoon Kim
Telephone:+82-10-2745-5228
E-mail:sbeng82@chol.com
Address: Rooms 1318-19,13/F,Hollywood Plaza,610 Nathan Road Mongkok,Kowloon,Hong Kong.
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