IC packaging substrate
- Product Description
-
Layers/layer amount: 2,4,6
·Line width/line spacing: 12/12 μ m, dense lines
·Center to center distance of ball welding pad/Lump pitch: 180 μ
·Ink type/older resistor type: dry film type/liquid and dry film type
·Typical Surface Finish: OSP
·Ink alignment SM Registration: ± 20 μ m
·Support impedance design/Support Impedance
Substrate features
·2-6 layer board
·Packaging method: FC
·Line width/line spacing: 12/12 μ m~25 μ m/25 μ m
application area
FCCSP substrates are used for packaging high-end processor chips in fields such as smartphones, tablets, and multimedia devices.
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