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AP/FCCSP
- Product Description
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● Structure: 2L ETS, Total thickness 140μm, 80μm PP
● ETS process, embedded layer L/S =13/13μm BOL Pitch:85um(45/12/13um)
● 95μm Blind via filled copper.
● AUS SR1/ thickness 15+/-7μm.
● Surface finish: OSP.
● Recess Depth: ≤5μm
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