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  • Product Description
  • Structure : 6L,2+2+2 ,Total thickness 400 μm, core thickness 150μm;
       Inner layer: 7$μm laser dirlled “X” hole ,copper filled. Outer layer:60μm
       laser blind via.

    Fine line: inner layer MSAP process, L/S =15/15 μm .
    AUS SR1/ thickness 15+/-7μm, SRO=105μm, SM shif tolerance≤15μm

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