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AP/FCCSP
- Product Description
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● Structure : 2L ,Total thickness170 μm, core thickness 100μm:
● MSAP process, L/S =20/20um
● 75um laser dirlled “X" hole , copper filled.
Bonding finger Pitch:95um(50/40μm)
BOL Pitch:55um(25/30 μm)
● Surface finish: Sof Ni/Au+OSP +Etch-back
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