Yanshen Technology
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Soft hard combination circuit board
·Line width/line spacing: 12/12 μ m, dense lines ·Center to center distance of ball welding pad/Lump pitch: 180 μ ·Ink type/older resistor type: dry film type/liquid and dry film type ·Typical Surface Finish: OSP ·Ink alignment SM Registration: ± 20 μ m ·Support impedance design/Support Impedance Substrate features
Key words:
·Line width/line spacing: 12/12 μ m, dense lines ·Center to center distance of ball welding pad/Lump pitch: 180 μ ·Ink type/older resistor type: dry film type/liquid and dry film type ·Typical Surface Finish: OSP ·Ink alignment SM Registration: ± 20 μ m ·Support impedance design/Support Impedance Substrate features
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