IC packaging substrate capability
FC-CSP substrate technology capability
Substrate features ·2-6 layer board ·Packaging method: FC ·Line width/line spacing: 12/12 μ m~25 μ m/25 μ m Application area FCCSP substrates are used for packaging high-end processor chips in fields such as smartphones, tablets, and multimedia devices.
WB-CSP substrate technology capability
Substrate features ·2-6 layer board ·Packaging method: WB ·Size: 3x3mm -23x23mm ·Plate thickness: 0.11mm~0.56mm ·Line width/line spacing: 25/25 μ m~40 μ m/40 μ m Application area Application processors for mobile phones, tablets, set-top boxes, etc
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